Eddy Wireless SD Cards Series Spezifikationen PDF herunterladen (Seite 18)

M12 Hardware Design

M12_HD_V3.3 - 17 -

3. Application interface

The module is equipped with a 64-pin 1.3mm pitch SMT pad that connects to the cellular

application platform. Sub-interfaces included in these pads are described in detail in the following

chapters:

 Power supply (refer to Section 3.3)

 Serial interfaces (refer to Section 3.8)

 Audio interfaces (refer to Section 3.9)

 SIM interface (refer to Section 3.10)

 SD interface (refer to Section 3.16)

Electrical and mechanical characteristics of the SMT pad are specified in Chapter 5&Chapter6.

3.1. Pins of module

3.1.1. Pin assignment

The following figure shows pin name and assignment of M12.

Quectel

Confidential

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Eddy Wireless SD Cards Series Spezifikationen Seite 18